Thermally conductive materials

 

With electronic systems and equipment is getting smaller and, at the same time, clock speed is rising, thermal management becomes more and more important. Heat must be dissipated from the component to the heat sink or any other type of cooling device.  

Heat causes:

To increase heat dissipation it is suggested to use thermal conductive gaskets, pads or pastes as a connection between the „hot spot“ and the cooling device.

Standard connections between „hot spot“ and cooling device could be 80 % air, which is the worst thermal conductor.  

We offer a variaty of materials like:

 

Thermally Conductive Paste

Main criteria for choosing thermally conductive paste are the thermal properties. It builds a thin binding film for very good thermal conductivity through the low thermal resistance. Due to the low viscosity of the material it can be applied by silk screening or masking technology.  

We offer thermal conductive pastes with a thermal conductivity between 0,25 to 4,5 W/mK.

 

Gap Filler

A main criteria, beside the thermal properties of this material, is to even out big gaps and tolerances between the component and the cooling device. It has been developed to close big gaps between a “hot spot” and heat. 

Gap fillers are silicone based and filled with ceramic material.

Gap fillers are supplied as die cut gasket or in standard sheets with material thickness from 0,5 to 15mm.

Thermal conductivity of gap fillers is between 1,0 W/mK – 5 W/mK. 

 

Thermally conductive tapes

Criteria for choosing conductive tapes are:

  • high bond strength to surfaces
  • thermal conductivity in combination with electrical isolation
  • excellent wet-out and high thermal performance

Typical applications include:

  • mounting of heat sink to “hot spots” (e. g. processors, motors etc.)
  • mounting of heat spreader to hot devices
  • LED lighting applications
 Thermal conductive materials