Adapted to the needs of our customers, we regularly expand our product portfolio.

To ensure that temperature-critical electronic components continue to function free from defects, we offer as of now:

NEW: SILICONE-FREE ONE COMPONENT GAP FILLER

• Dispensable 1C Gap filler enables auto-dispensing
• No outgassing
• No oil bleeding
• Thermal conductivity: 3,0 and 5,0 W/m*K

NEW: SILICONE-FREE GAP PADS

• No oil bleeding, no outgassing
• Thermal conductivity: 3,0 and 5,0 W/m*K
• Material thickness: 0,5 to 5,0 mm
• Certification according to UL94-V0

NEW: GRAPHITE FOILS

• Excellent thermal conductivity
• High temperature resistance
• Long service life
• Use in a variety of applications, good alternative to pastes

More products for heat management can be found here.