Adapted to the needs of our customers, we regularly expand our product portfolio.
To ensure that temperature-critical electronic components continue to function free from defects, we offer as of now:
NEW: SILICONE-FREE ONE COMPONENT GAP FILLER
- Dispensable 1C Gap filler enables auto-dispensing
- No outgassing
- No oil bleeding
- Thermal conductivity: 3,0 and 5,0 W/m*K
NEW: SILICONE-FREE GAP PADS
- No oil bleeding, no outgassing
- Thermal conductivity: 3,0 and 5,0 W/m*K
- Material thickness: 0,5 to 5,0 mm
- Certification according to UL94-V0
NEW: GRAPHITE FOILS
- Excellent thermal conductivity
- High temperature resistance
- Long service life
- Use in a variety of applications, good alternative to pastes
More products for heat management can be found here.
