MTC

Overview thermally conductive products

With electronic systems and equipments are getting smaller and, at the same time, clock speed is rising, thermal management becomes more and more important. Heat must be transferred from the component to the heat sink or any other type of cooling device because heat causes:

• slower operation speed,
• early failures,
• other power problems.

To increase heat dissipation it is suggested to use thermally conductive products as a connection between the „hot spot" and the cooling device. The connection (without use of an appropriate thermally conductive product) can consist of air up to 80%.

Thermally conductive materials have been developed to compensate uneven surfaces. By displacing the air with a highly conductive material heat dissipation is increased and the module is better cooled.

We hold a UL-94-V0 certification for some of our thermally conductive products.