Overview TCP

Our high-quality products for a reliable heat management are used wherever a seamless thermal connection between a heat source (component e.g. processor) and a heat sink (cooling element, PCB or chassis) must be ensured in order to efficiently dissipate the generated heat. Thermally conductive materials compensate unevennesses or air gaps. By displacing the air with a highly conductive material, the heat dissipation is optimized and the module is better cooled. You can avoid early failures, reduced working speed and other performance problems with our thermal management solutions.