SMD contact pads

contact pads are used exclusively on the printed circuit board and, due to their electrical and physical properties, they are an excellent alternative for the grounding of PCBs.

  • excellent electrical conductivity
  • high heat resistance (max. 300 °C)
  • high abrasion resistance
  • very good spring characteristics
  • SMT mountable characteristics for automatic soldering procedure
  • high adhesion after SMT

Fabric over foam gaskets do not have high temperature resistance and are not solderable in contrast. 

contact pads are available in two versions:

  • Type S:  silicone core coated with conductive silicone paste and a solderable tin plated copper foil on the bottom
  • Type W: silicone rubber coated with conductive solderable film

The parts are delivered in tape & reel packaging as standard.


Dimension (mm) 0,5 - 5,5 +/- 0,2
5,6 - 15,0 +/- 0,3
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